Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
Inventor
active
Chip size stack package, memory module having the same, and...
Multi-chip package
Semiconductor package and multi-chip semiconductor package...
Staircase shaped stacked semiconductor package
Wafer level stack package and method of fabricating the same
No associations
LandOfFree
Jae Myun Kim does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Jae Myun Kim, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Jae Myun Kim will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-1218837