Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-09-10
2010-11-02
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257S773000, C257S786000, C257SE23141
Reexamination Certificate
active
07825504
ABSTRACT:
Disclosed is a semiconductor package and a multi-chip semiconductor package. The semiconductor package includes a semiconductor chip having bonding pads located at a center portion thereof; redistribution patterns extending from the bonding pads toward one edge of the semiconductor chip; and dummy bump pads located adjacent to another edge of the semiconductor chip which is opposite the one edge.
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Hynix / Semiconductor Inc.
Ladas & Parry LLP
Parekh Nitin
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