Interconnection of a carrier substrate and a semiconductor devic

Details Interconnection of a carrier substrate and a semiconductor devic Interconnection of a carrier substrate and a semiconductor devic

1992-11-12

1999-01-12

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257779, 257778, H01L 2348

Patent

active

058594701

ABSTRACT:
Solder interconnection for forming connections between an integrated semiconductor device and a carrier substrate is provided. Located on the carrier substrate are electrodes and located between the electrodes and integrated semiconductor device are solder connections that have a relatively low melting point such that when the device is in operation, the solder connection will liquify thereby permitting expansion compensation between the substrate and semiconductor device.

REFERENCES:
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patent: 5147084 (1992-09-01), Behun et al.
Van Vestrout, "Floating Backbond Mounting for a Chip Device," IBM Tech. Disc. Bulletin, vol. 16, No. 3, Aug. 1973.
Kirk-Othmer Encyclopedia of Chemical Technology, vol. 4, Third Edition, pp. 394-395 (1978).
Solder Joint Life Improvement Using Adhesive Under Component, Research Disclosure, Jan., 1990, No. 309--Kenneth Mason Publications Ltd., England.

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