Method of making electronic package assembly with protective enc

Details Method of making electronic package assembly with protective enc Method of making electronic package assembly with protective enc

1995-04-19

1997-09-23

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29841, 22818021, 228214, 257684, 361783, H05K 334

Patent

active

056691378

ABSTRACT:
An electronic package assembly wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (e.g., printed circuit board). The assembly's projecting conductive leads are soldered. An encapsulant material (e.g., polymer resin) is used to provide reinforcement for the solder-lead connections, the encapsulant material being dispensed only along opposing sides of the package's housing which do not include projecting leads (and which are oriented substantially normal to the stresses imposed on the package during operation wherein high temperatures are attained). This dispensing may follow solder reflow and solidification. The invention is particularly useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.

REFERENCES:
patent: 3610870 (1971-10-01), Sakamoto
patent: 5414928 (1995-05-01), Bonitz et al.

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