4. Semiconductor device manufacturing: process
  5. Semiconductor substrate dicing
  6. By electromagnetic irradiation

Ivan Eliashevich

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Contact to n-GaN with Au termination

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Flip chip light emitting diode devices having thinned or...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Having diverse electrical device
Reexamination Certificate

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Flip chip light emitting diode with micromesas and a...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate

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Flip-chip light emitting diode device without sub-mount

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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GaN LED with solderable backside metal

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With particular semiconductor material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2482291

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