4. Semiconductor device manufacturing: process
  5. With measuring or testing
  6. Packaging or treatment of packaged semiconductor

Il Ung Kim

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Known-good die testing apparatus

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Method for manufacturing known good die array having solder bump

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Patent

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Test socket and method for producing known good dies using the t

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Profile ID: LFUS-PAI-P-535787

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