Known-good die testing apparatus

Details Known-good die testing apparatus Known-good die testing apparatus

1994-06-27

1995-12-26

Wieder, Kenneth A.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, G01R 3102

Patent

active

054791057

ABSTRACT:
A die testing apparatus according to the present invention includes a lead frame having a plurality of die pads, wherein a plurality of bare chips are mounted on the die pads. The bonding pads of each bare chips are connected to a plurality of leads associated with each die pad through a plurality of bonding wires. The die pads are supported by a plurality of tie bars and the leads are supported by an adhesion tape attached to the lead frame. The lead frame is placed in a test socket which includes an under socket having a plurality of slot grooves and an upper socket hinged with the under socket and having a plurality of slot holes and a plurality of test probes contacting the leads of the lead frame. The lead frame is fixed between the upper and under sockets by means of a plurality of pins penetrating the slot holes and guiding holes located at a periphery of the lead frame and then being inserted into the slot grooves, and one side of the lead frame is caught between the upper and under sockets by a clamp. The test socket has a plug portion with electrical contacts thereon, which is located at an edge of the socket so that it can be plugged into a testing board.

REFERENCES:
patent: 4329642 (1982-05-01), Luthi
patent: 4644269 (1987-02-01), Golder
patent: 5175491 (1992-12-01), Ewers
patent: 5177439 (1993-01-01), Liu
patent: 5180974 (1993-01-01), Mitchell

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