4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Hyun-Soo Chung

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Bottle cap

Bottles and jars – Closures – Stopper type
Reexamination Certificate

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Method of forming semiconductor chips, the semiconductor...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method of forming semiconductor chips, the semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Semiconductor packages with enhanced joint reliability and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stack-type semiconductor device having cooling path on its...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3062577

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