4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents

Hyoung-ho Roh

Inventor

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Printed circuit board and method of manufacturing the same

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Reexamination Certificate

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Printed circuit board and method of manufacturing the same

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate

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Semiconductor device which dissipates heat

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Profile ID: LFUS-PAI-P-827500

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