Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate
2008-12-04
2010-10-12
Talbot, Brian K (Department: 1715)
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
C427S096900, C427S097300, C427S098400
Reexamination Certificate
active
07811626
ABSTRACT:
Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit pattern on at least one surface of the prepreg layer; and forming a predetermined circuit pattern on the conductive film. In an embodiment, the prepreg layer has a thickness of at most about 0.15 mm and contains a fiber material and a resin material. In an embodiment, the content of the resin material in the prepreg layer is about 70% or less by volume. In an embodiment, the prepreg layer is composed of at least one prepreg layer.
REFERENCES:
patent: 3601523 (1971-08-01), Arndt
patent: 3610811 (1971-10-01), O'Keefe
patent: 3854973 (1974-12-01), Mersereau et al.
patent: 4115185 (1978-09-01), Carlson et al.
patent: 4751146 (1988-06-01), Maeda et al.
patent: 4878152 (1989-10-01), Sauzade et al.
patent: 4895752 (1990-01-01), McEwen
patent: 4981560 (1991-01-01), Kajihara et al.
patent: 5126192 (1992-06-01), Chellis et al.
patent: 5166292 (1992-11-01), Pottiger et al.
patent: 5314740 (1994-05-01), Ishii et al.
patent: 5512381 (1996-04-01), Konicek et al.
patent: 5958562 (1999-09-01), Tsuji et al.
patent: 6080684 (2000-06-01), Appelt et al.
patent: 6124023 (2000-09-01), Furuta et al.
patent: 6136733 (2000-10-01), Blumberg et al.
patent: 6174562 (2001-01-01), Bergstedt
patent: 6201305 (2001-03-01), Darveaux et al.
patent: 6224965 (2001-05-01), Haas et al.
patent: 6555208 (2003-04-01), Takada et al.
patent: 6692818 (2004-02-01), Hirano et al.
patent: 6713163 (2004-03-01), Saito
patent: 6740411 (2004-05-01), Kojima et al.
patent: 6808798 (2004-10-01), Tobita
patent: 7005750 (2006-02-01), Liu
Jang Chang-soo
Roh Hyoung-ho
Ryu Jae-chul
Won Dong-kwan
Drinker Biddle & Reath LLP
Samsung Techwin Co. Ltd.
Talbot Brian K
LandOfFree
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