4. Plastic and nonmetallic article shaping or treating: processes
  5. Outside of mold sintering or vitrifying of shaped inorganic...
  6. Removal of liquid component or carrier through porous or...

Hyo Soo Lee

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BGA package having half-etched bonding pad and cut plating...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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BGA package with concave shaped bonding pads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Method for producing SiC preform with high volume fraction

Plastic and nonmetallic article shaping or treating: processes – Outside of mold sintering or vitrifying of shaped inorganic... – Removal of liquid component or carrier through porous or...
Reexamination Certificate

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Method of fabricating printed circuit board having thin core...

Metal working – Method of mechanical manufacture – Electrical device making
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Process for preparing a preform with high volume fraction SiC

Plastic and nonmetallic article shaping or treating: processes – Outside of mold sintering or vitrifying of shaped inorganic... – Removal of liquid component or carrier through porous or...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2129479

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