Method of fabricating printed circuit board having thin core...

Details Method of fabricating printed circuit board having thin core... Method of fabricating printed circuit board having thin core...

2005-03-22

2008-03-25

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S851000, C029S852000, C156S248000, C156S289000, C174S255000

Reexamination Certificate

active

07346982

ABSTRACT:
A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after the fabrication of the PCB, thereby reducing the thickness of the final product.

REFERENCES:
patent: 5495665 (1996-03-01), Carpenter et al.
patent: 5591519 (1997-01-01), Caron et al.
patent: 6580036 (2003-06-01), Kim et al.
patent: 6696764 (2004-02-01), Honda
patent: 7189302 (2007-03-01), Hwang et al.
patent: 2004-87701 (2004-03-01), None
patent: 2004-186265 (2004-07-01), None
patent: 2004-235323 (2004-08-01), None
patent: 10-2003-0046050 (2003-06-01), None

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