4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Configuration or pattern of bonds

Hyeong-Seob Kim

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Semiconductor chip having a bonding window smaller than a wire b

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent

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Semiconductor package having ultra-thin thickness and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Semiconductor package including a semiconductor device, and...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Semiconductor package including a semiconductor device, and...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Three-dimensional multi-chip package having chip selection...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-907323

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