4. Organic compounds -- part of the class 532-570 series
  5. Organic compounds
  6. Chalcogen bonded directly to ring carbon of the purine ring...

Huong T. Nguyen

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Adhesion of tungsten nitride films to a silicon surface

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Adhesion of tungsten nitride films to a silicon surface

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Anhydrous crystalline 9-(1,3-dihydroxy-2-propoxymethyl)guanine

Organic compounds -- part of the class 532-570 series – Organic compounds – Chalcogen bonded directly to ring carbon of the purine ring...
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Method of photoresist removal in the presence of a...

Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1975378

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