Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
Inventor
active
Flip chip device having soldered metal posts by surface...
Method for filling multi-layer chip-stacked gaps
Substrate for multi-chip stacking, multi-chip stack package...
Universal substrate for a semiconductor device having...
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Profile ID: LFUS-PAI-P-2375225