Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Inventor
active
Integrated circuit package system with wire bond pattern
Method of manufacturing a semiconductor package with fine...
Micro chip-scale-package system
Semiconductor system with fine pitch lead fingers
No associations
LandOfFree
Hun Teak Lee does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Hun Teak Lee, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hun Teak Lee will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-2259487