Integrated circuit package system with wire bond pattern

Details Integrated circuit package system with wire bond pattern Integrated circuit package system with wire bond pattern

2011-01-04

2011-01-04

Toledo, Fernando L (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S182000, C257S735000, C257S736000, C257S737000, C257S203000, C257S665000, C257S666000, C257S667000, C257S668000, C257S669000, C257S670000, C257S671000, C257S672000, C257S673000, C257S674000, C257SE21506, C257SE23014, C257SE23015, C257SE23031, C257SE23048, C257SE23061, C438S123000, C438S460000, C438S461000, C438S462000, C438S463000, C438S464000, C438S465000

Reexamination Certificate

active

07863737

ABSTRACT:
An integrated circuit package system including providing a plurality of substantially identical package leads formed in a single row, and attaching bond wires having an offset on adjacent locations of the package leads.

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