Micro chip-scale-package system

Details Micro chip-scale-package system Micro chip-scale-package system

2007-11-20

2007-11-20

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S787000

Reexamination Certificate

active

11307314

ABSTRACT:
A micro chip-scale-package system including providing a metal pattern on an adhesion material, attaching an integrated circuit die to the metal pattern, and molding an encapsulant over the integrated circuit die and the metal pattern.

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