Method of manufacturing a semiconductor package with fine...

Details Method of manufacturing a semiconductor package with fine... Method of manufacturing a semiconductor package with fine...

2011-03-22

2011-03-22

King, Roy (Department: 1733)

Metal fusion bonding

Process

Plural joints

C228S004500, C228S001100, C438S123000, C257S784000, C257S667000, C257S676000

Reexamination Certificate

active

07909233

ABSTRACT:
A method for manufacturing a semiconductor package system includes: providing a die having a plurality of contact pads; forming a leadframe having a plurality of lead fingers with flat tops of predetermined lengths, the plurality of lead fingers having a fine pitch and each having a trapezoidal cross-section; attaching a plurality of bumps to the plurality of lead fingers, the plurality of bumps on the tops, extending beyond the widths of the trapezoidal cross-sections, and clamping down on the two sides of each of the plurality of lead fingers; attaching a plurality of bond wires to the plurality of contact pads; attaching the plurality of bond wires to the plurality of bumps; and forming an encapsulant over the plurality of lead fingers, the die, and the plurality of bond wires, the encapsulant leaving lower surfaces of the plurality of lead fingers exposed.

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