4. Equipment for production, distribution, or transformation of ene
  5. Distribution, modification or control
  6. Electron or vacuum tube

Hui-Yen Huang

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Front and rear covering type LED package structure and...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate

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LED package structure and method for making the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Metal base design for surface mount device LED (light...

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Electron or vacuum tube
Design Patent

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Method for manufacturing an LED chip package structure

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method of manufacturing a substrate structure for increasing...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2885841

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