Method for manufacturing an LED chip package structure

Details Method for manufacturing an LED chip package structure Method for manufacturing an LED chip package structure

2009-03-24

2010-11-02

Dickey, Thomas L (Department: 2893)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C257SE21499

Reexamination Certificate

active

07824938

ABSTRACT:
An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.

REFERENCES:
patent: 2005/0030762 (2005-02-01), Kato et al.
patent: 2007/0080438 (2007-04-01), Yamanaka et al.

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