Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2009-03-24
2010-11-02
Dickey, Thomas L (Department: 2893)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C257SE21499
Reexamination Certificate
active
07824938
ABSTRACT:
An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.
REFERENCES:
patent: 2005/0030762 (2005-02-01), Kato et al.
patent: 2007/0080438 (2007-04-01), Yamanaka et al.
Chuang Jonnie
Huang Hui-Yen
Wang Bily
Dickey Thomas L
Harvatek Corporation
Rosenberg , Klein & Lee
Yushin Nikolay
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