LED package structure and method for making the same

Details LED package structure and method for making the same LED package structure and method for making the same

2007-05-01

2007-05-01

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S676000, C257S666000

Reexamination Certificate

active

11085100

ABSTRACT:
An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.

REFERENCES:
patent: 5309460 (1994-05-01), Fujimaki et al.
patent: 2002/0004251 (2002-01-01), Roberts et al.
patent: 2003/0178711 (2003-09-01), Honda et al.

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