Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-12-16
2010-02-16
Garber, Charles D (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S014000, C438S015000, C438S025000, C438S026000, C438S048000, C438S051000, C438S055000, C438S064000, C438S068000, C438S113000, C257SE21237, C257SE21238, C257SE21513
Reexamination Certificate
active
07662661
ABSTRACT:
A method of manufacturing a substrate structure includes the steps of: (1) providing a metal substrate having a metal portion; (2) chemically etching a plurality of trenches in the metal substrate; (3) applying a polymer composite material into the trenches to form a substrate having a polymer composite portion abutted to the metal portion; (4) polishing a surface of the substrate to make a height of the polymer composite portion equal to that of the metal portion; (5) forming a covering material on the surface of the substrate; and (6) cutting the substrate via the polymer composite portion for decreasing cutting bur produced on the metal portion. Furthermore, the method is provided for combining the metal substrate and the polymer composite material, thereby to increase cutting precision and strength of the substrate structure.
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Chuang Jonnie
Huang Hui-Yen
Wang Bily
Ahmadi Mohsen
Garber Charles D
Harvatek Corporation
Rosenberg , Klein & Lee
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