4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Integrated circuit structure with electrically isolated...
  6. Passive components in ics

Hsien-Chie Cheng

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Composite bump

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Electrode structure of memory capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Three-dimensional multichip stack electronic package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2385377

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