Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2006-03-10
2008-05-27
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S781000
Reexamination Certificate
active
07378746
ABSTRACT:
A composite bump suitable for disposing on a substrate pad is provided. The composite bump includes a compliant body and an outer conductive layer. The coefficient of thermal expansion (CTE) of the compliant body is between 5 ppm/° C. and 200 ppm/° C. The outer conductive layer covers the compliant body and is electrically connected to the pad. The compliant body can provide a stress buffering effect for a bonding operation. Furthermore, by setting of the CTE of the compliant body within a preferable range, damages caused by thermal stress are reduced while the bonding effect is enhanced.
REFERENCES:
patent: 5508228 (1996-04-01), Nolan et al.
patent: 5877556 (1999-03-01), Jeng et al.
patent: 6084301 (2000-07-01), Chang et al.
patent: 6337445 (2002-01-01), Abbott et al.
patent: 2006/0110678 (2006-05-01), Dueber et al.
Chang Shyh-Ming
Chen Tai-Hong
Cheng Hsien-Chie
Lin Ji-Cheng
Lin Yao-Sheng
Clark S. V.
Industrial Technology Research Institute
Jianq Chyun IP Office
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