4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Hsi-Jen J. Yeh

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Apparatus for fabricating self-assembling microstructures

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
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Method and apparatus for fabricating self-assembling microstruct

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Method for fabricating self-assembling microstructures

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor
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Method for fabricating self-assembling microstructures

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Near-field optical apparatus with a laser having a non-uniform e

Dynamic information storage or retrieval – Specific detail of information handling portion of system – Radiation beam modification of or by storage medium
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Profile ID: LFUS-PAI-P-426111

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