Method for fabricating self-assembling microstructures

Details Method for fabricating self-assembling microstructures Method for fabricating self-assembling microstructures

1993-12-17

1996-08-13

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156626, 156633, 156649, 156657, 156662, 156631, 437 8, 437 86, 437209, 437226, H01L 213065, B44C 122

Patent

active

055452914

ABSTRACT:
A method for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks self-align into recessed regions located on a substrate such that the microstructure becomes integral with the substrate 20, 70, 90, 120, 200. The improved method includes a step of transferring the shaped blocks into a fluid to create a slurry. Such slurry is then poured evenly over the top surface of a substrate having recessed regions thereon. The microstructure via the shape and fluid tumbles onto the surface of the substrate, self-aligns, and engages into a recessed region.

REFERENCES:
patent: 3439416 (1969-04-01), Yando
patent: 3756872 (1973-09-01), Goodman
patent: 4111294 (1978-09-01), Carpenter et al.
patent: 4194668 (1980-03-01), Akyurek
patent: 4542397 (1985-09-01), Biegelsen et al.
patent: 4554611 (1985-11-01), Lewin
patent: 4802951 (1989-02-01), Clark et al.
patent: 4843035 (1989-06-01), Takashima
patent: 4907062 (1990-03-01), Fukushima
patent: 4949148 (1990-08-01), Bartelink
patent: 4962441 (1990-10-01), Collins
patent: 4975143 (1990-12-01), Drake et al.
patent: 4990462 (1991-02-01), Slina
patent: 5034802 (1991-07-01), Liebes, Jr. et al.
patent: 5063177 (1991-11-01), Geller et al.
patent: 5075253 (1991-12-01), Sliwa, Jr.
Cohn et al., "Self-Assembling Electrical Networks: An Application of Micromachining Technology," 1991 International Conference on Solid-State Sensors & Actuators, San Fransisco, Jun. 25, 1991,pp. 490-493.
Huang et al., "Electrode design for negative dielectrophoresis," Meas. Sci. Technol. (1991) 2 : 1142-1146.

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