Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Patent
1995-06-07
1999-05-18
Tung, T.
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
216 41, 216 95, 216 96, 216 99, 216108, 438800, H01L21/00
Patent
active
059045450
ABSTRACT:
Apparatus for assembling microstructures onto a substrate through fluid transport. The apparatus includes a vessel that contains the substrate, a fluid, and microstructures. The substrate has at least one recessed region thereon. The microstructures being shaped blocks self-align into the recessed regions located on the substrate such that the microstructure becomes integral with the substrate. The apparatus also includes a pump that circulates the microstructures within the vessel at a rate where at least one of the microstructures is disposed into the recessed region.
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Hadley Mark A.
Smith John Stephen
Verma Ashish K.
Yeh Hsi-Jen J.
Ogawa Richard T.
The Regents of the University of California
Tung T.
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