Method for fabricating self-assembling microstructures

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257622, 257623, 257627, 257628, H01L 2972

Patent

active

057838569

ABSTRACT:
A method for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks self-align into recessed regions located on a substrate such that the microstructure becomes integral with the substrate 20, 70, 90, 120, 200. The improved method includes a step of transferring the shaped blocks into a fluid to create a slurry. Such slurry is then poured evenly over the top surface of a substrate having recessed regions thereon. The microstructure via the shape and fluid tumbles onto the surface of the substrate, self-aligns, and engages into a recessed region.

REFERENCES:
patent: 3439416 (1969-04-01), Yando
patent: 3725160 (1973-04-01), Bean et al.
patent: 3756872 (1973-09-01), Goodman
patent: 4111294 (1978-09-01), Carpenter et al.
patent: 4194668 (1980-03-01), Akyurek
patent: 4542397 (1985-09-01), Biegelsen et al.
patent: 4554611 (1985-11-01), Lewin
patent: 4802951 (1989-02-01), Clark et al.
patent: 4843035 (1989-06-01), Takashima
patent: 4907062 (1990-03-01), Fukushima
patent: 4949148 (1990-08-01), Bartelink
patent: 4962441 (1990-10-01), Collins
patent: 4975143 (1990-12-01), Drake et al.
patent: 4990462 (1991-02-01), Sliwa, Jr.
patent: 5034802 (1991-07-01), Liebes, Jr. et al.
patent: 5063177 (1991-11-01), Geller et al.
patent: 5075253 (1991-12-01), Sliwa, Jr.
Cohn et al., "Self-Assembling Electrical Networks: An Application of Micromachining Technology," 1991 International Conference on Solid-State Sensors & Actuators, San Francisco, Jun. 25, 1991, pp. 490-493.
Huang et al., "Electrode design for negative dielectro-phoresis," Meas. Sci. Technol. (1991) 2:1142-1146.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating self-assembling microstructures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating self-assembling microstructures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating self-assembling microstructures will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1649188

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.