4. Semiconductor device manufacturing: process
  5. Semiconductor substrate dicing
  6. With attachment to temporary support or carrier

Holger Woerner

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Electronic component with a plastic package and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Electronic component with a stack of semiconductor chips and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Electronic device configured as a multichip module,...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method for producing a semiconductor component with a...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Semiconductor component with electromagnetic shielding device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2209905

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