Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-03-07
2006-03-07
Thomas, Tom (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S787000, C257S789000, C257S790000
Reexamination Certificate
active
07009288
ABSTRACT:
A semiconductor component with an electromagnetic shielding device against alpha radiation, beta radiation and high-frequency electromagnetic radiation is presented. The semiconductor component includes a semiconductor chip with a circuit integrated therein with a number of electrical terminal areas and at least one ground terminal area. The semiconductor also includes a package that contains the semiconductor chip and also a chip carrier. The chip carrier has a number of external electrical terminals and an external ground terminal. The electrical terminal areas and the ground terminal areas of the semiconductor chip are electrically connected to the external electrical terminals and the external ground terminals of the chip carrier by connecting means. The semiconductor chip and the connecting means are in this case encapsulated by an electrically insulating passivation. The semiconductor chip encapsulated in this way is in turn encapsulated with an electrically and thermally conductive plastics compound, which forms the package and is electrically connected to the ground terminal.
REFERENCES:
patent: 4661837 (1987-04-01), Sono
patent: 5656857 (1997-08-01), Kishita
patent: 5668406 (1997-09-01), Egawa
patent: 5869905 (1999-02-01), Takebe
patent: 5982026 (1999-11-01), Tsunoda
patent: 6020637 (2000-02-01), Karnezos
patent: 6150193 (2000-11-01), Glenn
patent: 6181278 (2001-01-01), Kakimoto et al.
patent: 6432497 (2002-08-01), Bunyan
patent: 6492194 (2002-12-01), Bureau et al.
patent: 6696643 (2004-02-01), Takano
patent: 6800804 (2004-10-01), Igarashi et al.
patent: WO 99/23153 (1999-05-01), None
patent: WO 99/60627 (1999-11-01), None
Bauer Michael
Birzer Christian
Ernst Georg
Steiner Rainer
Vilsmeier Hermann
Chu Chris C.
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
Thomas Tom
LandOfFree
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