Method for producing a semiconductor component with a...

Details Method for producing a semiconductor component with a... Method for producing a semiconductor component with a...

2007-04-10

2007-04-10

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S118000, C438S127000, C257SE21502

Reexamination Certificate

active

11341895

ABSTRACT:
A process for producing a semiconductor component having a plastic housing in which at least one semiconductor chip is arranged includes providing a semiconductor wafer having semiconductor chips which are arranged in rows and columns and have active top surfaces and back surfaces, the active top surfaces being provided with contact surfaces. The semiconductor wafer are divided into individual semiconductor chips, which are mounted on a carrier plate that has a thermosensitive adhesive on its top surface, such that the active top surfaces of the individual semiconductor chips are placed onto the top surface of the carrier plate. A common carrier is produced from a plastic embedding compound on the carrier plate, with the semiconductor chips being embedded in the plastic embedding compound. The carrier plate is removed by heating the thermosensitive adhesive to a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action.

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