Electronic component with a stack of semiconductor chips and...

Details Electronic component with a stack of semiconductor chips and... Electronic component with a stack of semiconductor chips and...

2007-03-13

2007-03-13

Ha, Nathan W. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000

Reexamination Certificate

active

10669539

ABSTRACT:
The invention relates to a method for producing an electronic component, a stack of semiconductor chips, and an electronic component including a stack of semiconductor chips. The stack has at least a lower electronic module connected via flipchip connections to a central area of a rewiring substrate. The stack also has at least an upper electronic module with external contact surfaces connected via bonding connections to outer areas of the rewiring substrate.

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patent: 100 43 450 (2002-03-01), None
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patent: 1 317 001 (2003-06-01), None

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