Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
Inventor
active
Low leakage wire bond pad structure for integrated circuits
Method for fabricating a stress buffered bond pad
Method of using a tunneling diode in optical sensing devices
Method to preserve the testing chip for package's quality
Optical sensor by using tunneling diode
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Profile ID: LFUS-PAI-P-698071