4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents

Hisashi Wakako

Inventor

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active

Ceramic IC package base and ceramic cover

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Method for fabricating printed-wiring substrate

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate

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Printed-wiring substrate and method for fabricating the same

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Printed-wiring substrate and method for fabricating the...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Process for producing a substrate and plating apparatus

Coating processes – With post-treatment of coating or coating material – Cooling
Reexamination Certificate

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Profile ID: LFUS-PAI-P-92529

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