Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-11-24
1998-08-25
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257703, 257705, 257706, H01L 2334, H01L 2306, H01L 2315, H01L 2310
Patent
active
057985669
ABSTRACT:
In accordance with the present invention, there is provided a ceramic IC package base which comprises a ceramic substrate, and a heat radiating member adhered to a side surface of the ceramic substrate and made of copper or copper alloy. The heat radiating member has an adhering portion at which it is adhered to the ceramic substrate. The adhering portion, when the heat radiating member is observed in a plan view, has one side which is equal to or larger than 8 mm. The adhering portion is of the thickness within the range from 0.25 mm to 0.76 mm. A ceramic IC package cover is also provided.
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patent: 4123293 (1978-10-01), Okikawa et al.
patent: 4680618 (1987-07-01), Kuroda et al.
patent: 5216279 (1993-06-01), Nakao
patent: 5448107 (1995-09-01), Osada et al.
patent: 5451817 (1995-09-01), Osada et al.
Kimura Kazuo
Kitou Masanori
Sato Kazuhisa
Wakako Hisashi
Clark Jhihan B.
NGK Spark Plug Co. Ltd.
Saadat Mahshid D.
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