Method for fabricating printed-wiring substrate

Details Method for fabricating printed-wiring substrate Method for fabricating printed-wiring substrate

2005-05-03

2005-05-03

Chen, Bret (Department: 1762)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S125000, C427S272000, C427S405000, C427S430100

Reexamination Certificate

active

06887512

ABSTRACT:
A method for fabricating a component board which includes forming a first main-face-side Au plating layer on surfaces of main-face-side connection terminals and a first back-face-side Au plating layer on surfaces of back-face-side connection terminals of the component board; covering the first main-face-side Au plating layer with a protection layer; forming a second back-face-side Au plating layer on the first back-face-side Au plating layer; and removing the protection layer after completing the second Au plating step. Alternatively, the first back-face-side Au plating layer may be removed after completing the masking step. Displacement Au plating is used as the first and second Au plating.

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