4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Hiroshi Kawashimo

Inventor

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active

Lead frame including hanging leads and hanging lead reinforcemen

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Method of manufacturing aluminum bonding pad with PSG coating

Fishing – trapping – and vermin destroying
Patent

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Wire bonding apparatus and wire bonding method

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Reexamination Certificate

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Wire bonding method

Metal fusion bonding – Process – Plural joints
Patent

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Profile ID: LFUS-PAI-P-1114472

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