Lead frame including hanging leads and hanging lead reinforcemen

Details Lead frame including hanging leads and hanging lead reinforcemen Lead frame including hanging leads and hanging lead reinforcemen

1998-09-30

2000-02-01

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257696, 257698, 257669, 257674, 257670, H01L 2350, H01L 2348, H01L 2328, H01L 23495

Patent

active

06020625&

ABSTRACT:
A semiconductor device includes a lead frame including a die pad having corners, inner leads having respective inner end portions, outer leads, a hanging lead reinforcement, first hanging leads, and second hanging leads; a semiconductor chip bonded to the lead frame; and metal wires bonding the chip to the lead frame. A length of one side of the semiconductor chip is 2.5 mm smaller than a side of a molded resin external dimension, one side of the largest dimension of the hanging lead frame reinforcement not being longer than one side of the semiconductor chip. The die pad is sunk where second hanging leads are connected to the hanging lead reinforcement and has a step where connected to the second hanging leads. The camber of the external shape of the semiconductor device is reduced and a semiconductor device with high quality and reliability is obtained.

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patent: 5789806 (1998-08-01), Chua et al.
patent: 5859471 (1999-01-01), Kuraishi et al.
patent: 5874773 (1999-02-01), Terada et al.
patent: 5910681 (1999-06-01), Kozono

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