Wire bonding method

Details Wire bonding method Wire bonding method

1992-01-21

1993-05-04

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

328 45, B23K 3102, H01L 21603

Patent

active

052077861

ABSTRACT:
A wire bonding apparatus includes a capillary tip through which a fine metal wire passes, a first clamp disposed above the capillary tip for clamping the fine metal wire, a second clamp disposed above the first clamp for clamping the fine metal wire, a first moving mechanism for moving the capillary tip up and down, and a second moving mechanism for moving the first clamp up and down with respect to the capillary tip in order that an excess length of the fine metal wire which protrudes from the capillary tip may be drawn back into the capillary tip. In a method of using the apparatus, the first clamp clamps the fine metal wire and retracts it through the capillary tip to avoid an excessive wire length between a ball bond and a wire bond in the completed product. The second clamp clamps the wire during the wire bonding process to ensure that excess retracted wire does not again pass through the capillary tip.

REFERENCES:
patent: 4597522 (1986-07-01), Kobayashi
patent: 4789095 (1988-12-01), Kobayashi
patent: 5037023 (1991-08-01), Akiyama et al.

Affiliated with

Also associated with

Rating

Wire bonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire bonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire bonding method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1972360