4. Image analysis
  5. Applications
  6. Manufacturing or product inspection

Hiromi Tomiyama

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Bonding wire detection method

Optics: measuring and testing – By polarized light examination – With light attenuation
Patent

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Bonding wire height detection method

Optics: measuring and testing – By polarized light examination – With light attenuation
Patent

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Wire bend inspection method and apparatus

Image analysis – Applications – Manufacturing or product inspection
Patent

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Workpiece conveying apparatus used with workpiece inspection dev

Classifying – separating – and assorting solids – Precedent preparation of items or materials to facilitate... – Sorting special items or sorting by methods and apparatus...
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Profile ID: LFUS-PAI-P-192027

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