Image analysis – Applications – Manufacturing or product inspection
Patent
1996-11-25
1998-10-06
Mancuso, Joseph
Image analysis
Applications
Manufacturing or product inspection
25055934, 257784, 348126, G06K 900, G01N 2100, H01L 2348
Patent
active
058189580
ABSTRACT:
A method and apparatus for inspecting bends in wires bonded between, for instance, pads of semiconductor chips and leads of lead frames using detection ranges established within imaging ranges in which images of bends are taken. Imaging range areas are established by dividing the distance between a first bonding point and a second bonding point of a target wire by the width of the detection range, and the wire bend is then detected in the respective imaging range areas.
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Kanayama Naoki
Nakagawa Takeyuki
Tomiyama Hiromi
Kabushiki Kaisha Shinkawa
Mancuso Joseph
Patel Jayanti K.
Shinkawa U.S.A., Inc.
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