Bonding wire height detection method

Details Bonding wire height detection method Bonding wire height detection method

1995-09-08

1996-12-10

Evans, F. L.

Optics: measuring and testing

By polarized light examination

With light attenuation

356384, 25055934, G01B 1100

Patent

active

055836410

ABSTRACT:
A method for evaluating the height of a wire bonded between a semiconductor chip and a lead frame including the steps of: investigating the correlation between wire height and wire width beforehand by shifting the focusing level of an optical system, setting a detection level which is the focusing level of the optical system based upon an upper limit level and a lower limit level which are to be the standard levels for the height of the wire to be detected. The acceptability of the height of the wire is judged by ascertaining whether or not the imaged width of the wire is within the wire width range which is between the upper and lower limit levels of the correlation between the wire height and the wire width.

REFERENCES:
patent: 4942618 (1990-07-01), Sumi et al.
patent: 5030008 (1991-07-01), Scott et al.
patent: 5347362 (1994-09-01), Sugawara

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