Bonding wire detection method

Details Bonding wire detection method Bonding wire detection method

1995-09-08

1996-11-19

Evans, F. L.

Optics: measuring and testing

By polarized light examination

With light attenuation

356376, 25055934, G01B 1100, G01B 1124

Patent

active

055768288

ABSTRACT:
The height of a wire bonded between a semiconductor chip and a lead frame being determined using an illumination from circularly arranged LED's installed in a low-angle illuminating device. The angle of the illumination is set at seven (7) to twelve (12) degrees, preferably at ten (10) degrees, with respect to a horizontal plane, and a focal depth of an optical device is set to be shallow, thus letting a dark area appear in the central portion of the wire at the focal point of the optical system.

REFERENCES:
patent: 4942618 (1990-07-01), Sumi et al.
patent: 5030008 (1991-07-01), Scott et al.
patent: 5347362 (1994-09-01), Sugawara

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