4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Hiromi Fujisawa

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Wire bonding method, wire bonding apparatus, and wire...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Wire loop, semiconductor device having same and wire bonding...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Wire loop, semiconductor device having same, wire bonding...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Wire loop, semiconductor device having same, wire bonding...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2877629

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