Wire bonding method, wire bonding apparatus, and wire...

Details Wire bonding method, wire bonding apparatus, and wire... Wire bonding method, wire bonding apparatus, and wire...

2010-04-22

2011-10-25

Stoner, Kiley (Department: 1735)

Metal fusion bonding

Process

Plural joints

C228S004500

Reexamination Certificate

active

08042725

ABSTRACT:
The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed.

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