Wire loop, semiconductor device having same and wire bonding...

Details Wire loop, semiconductor device having same and wire bonding... Wire loop, semiconductor device having same and wire bonding...

2006-01-04

2010-10-19

Ward, Jessica L (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S004500, C438S617000

Reexamination Certificate

active

07815095

ABSTRACT:
A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire includes a ball bonded to the first bonding point, a neck portion adjacent to the ball and a major portion extending from the neck portion to the second bonding point. The neck portion includes a riser part which extends, from the bonded ball, obliquely upward in a direction toward the second bonding point, and the riser part is formed by a top portion of the ball which has entered an opening of a capillary and been shaped at the time of ball bonding. The riser part is formed by inclining the top portion of the ball, which enters the opening of the capillary at the time of ball bonding, which inclining is done by moving the capillary obliquely upward toward the second bonding point.

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