Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-08-28
2007-08-28
Huynh, Andy (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S784000, C257SE23024, C228S904000
Reexamination Certificate
active
11113690
ABSTRACT:
A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire has a crushed part formed therein by crushing the part of the wire and a top of a ball bonded to the first bonding point with a capillary. The wire loop is formed by a wire bonding method which includes: bonding the wire to the first bonding point; moving the capillary horizontally and vertically while carrying out loop control; bonding the wire to the vicinity of the top of the ball bonded to the first bonding point; and thereafter, moving the capillary horizontally and vertically to the second bonding point while delivering the wire and carrying out loop control, and then bonding the wire to the second bonding point.
REFERENCES:
patent: 5299729 (1994-04-01), Matsushita et al.
patent: 5566876 (1996-10-01), Nishimaki et al.
patent: 5735030 (1998-04-01), Orcutt
patent: 6036080 (2000-03-01), Takahashi et al.
patent: 6062462 (2000-05-01), Gillotti et al.
patent: 6079610 (2000-06-01), Maeda et al.
patent: 6080651 (2000-06-01), Takahashi et al.
patent: 6268662 (2001-07-01), Test et al.
patent: 6315190 (2001-11-01), Nishiura
patent: 6815836 (2004-11-01), Ano
patent: 2001/0002624 (2001-06-01), Khandros et al.
patent: 2002/0050653 (2002-05-01), Masumoto et al.
patent: 0 753 891 (1997-01-01), None
patent: 03183139 (1991-09-01), None
patent: 04-273135 (1992-09-01), None
patent: 06-132347 (1994-05-01), None
patent: 9-51011 (1997-02-01), None
patent: 09051011 (1997-02-01), None
patent: 10-199916 (1998-07-01), None
patent: 2000-36512 (2000-02-01), None
patent: 2000-277558 (2000-06-01), None
patent: 2004-172477 (2004-06-01), None
Huynh Andy
Kaijo Corporation
Taylor Earl
LandOfFree
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