4. Metal fusion bonding
  5. With control means responsive to sensed condition
  6. Work-responsive

Hiroko Koike

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Apparatus for positioning a thin plate

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Reexamination Certificate

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Capacitor, circuit board, method of formation of capacitor,...

Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate

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Method of formation of a capacitor with a solid electrolyte...

Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate

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Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate

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Semiconductor device and process of producing same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2464125

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