Capacitor, circuit board, method of formation of capacitor,...

Details Capacitor, circuit board, method of formation of capacitor,... Capacitor, circuit board, method of formation of capacitor,...

2007-02-13

2007-02-13

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Having organic semiconductive component

C438S239000, C438S240000, C438S957000, C029S025030, C257SE21010

Reexamination Certificate

active

11068884

ABSTRACT:
A method of formation of a capacitor forming part of an electric circuit when producing a circuit board, consisting of forming a valve metal bottom electrode layer and a valve metal oxide dielectric layer on the same, then integrally forming a solid electrolyte layer comprised of an organic semiconductor and a top electrode layer comprised of metal on the same, this integral formation step consisting of the step of holding one surface of metal foil for the top electrode at a bonding wedge and making the other surface of the metal foil carry a powder of the organic semiconductor by compression bonding and heating and the step of compression bonding the organic semiconductor powder carried by compression bonding at the dielectric layer by a bonding wedge through metal foil, whereby a solid electrolyte layer comprised of an organic semiconductor sandwiched between the metal foil and dielectric layer and closely bonded with the two is formed, a capacitor built into a circuit board, a circuit board including a capacitor, and a method of production of the circuit board.

REFERENCES:
patent: 4609971 (1986-09-01), Shaffer
patent: 4729844 (1988-03-01), Tsuchiya et al.
patent: 4982312 (1991-01-01), Shindo et al.
patent: 5972052 (1999-10-01), Kobayashi et al.
patent: 6454817 (2002-09-01), Shin et al.
patent: 6498714 (2002-12-01), Fujisawa et al.
patent: 6882520 (2005-04-01), Kamigawa et al.
patent: 6919240 (2005-07-01), Uzawa et al.

Affiliated with

Also associated with

Rating

Capacitor, circuit board, method of formation of capacitor,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Capacitor, circuit board, method of formation of capacitor,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Capacitor, circuit board, method of formation of capacitor,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3884076